TSMC FinFlex™, N2 Process Innovations Debut at 2022 North America Technology Symposium
SANTA CLARA, Calif.–(BUSINESS WIRE)–TSMC (TWSE: 2330, NYSE: TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex™ technology for the N3 and N3E processes making their debut. Resuming […]


