Samsung’s 12-Layer 3D-TSV Chip Packs More Memory in the Same Size
Samsung has developed what it calls an industry first 12-layer 3D-TSV chip packaging technology that will allow customers to release newer generations of high-performance products without having to chance system configurations. The electronic device manufacturer said it solved one of the most challenging packaging technologies for high-performance chips. Pinpoint accuracy is required to vertically interconnect […]
