Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform
Industry’s first comprehensive 3D-IC platform for multi-chiplet design and advanced packaging Highlights: Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities Cadence’s third-generation 3D-IC solution supports a wide range of application areas, including hyperscale […]



