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Search Results: mass communication

Syniverse Is First to Offer a Cloud-Native, Hyperscale Digital Communications and Messaging Platform for Enterprises: Syniverse’s Hyperscale Communications Platform

February 27, 2022 TechDecisions Staff Leave a Comment

 New Syniverse CPaaS Platform to Accelerate Enterprises’ Digital Transformation and Improve Customer Experience BARCELONA, Spain–(BUSINESS WIRE)–#CPaaS—Mobile World Congress 2022—Syniverse®, “the world’s most connected company”®, today announced it is the first global messaging and Communications Platform-as-a-Service (CPaaS) provider to offer a cloud-native, hyperscale digital engagement platform to improve enterprises’ customer experiences and accelerate their digital transformations. […]

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Mass notification system, fire alarm

How Mass Notification is Evolving to Manage Emergencies

Organizations should seek mass notification solutions that give them the ability to actively manage an event from beginning to end.

February 23, 2022 Paul Shain Leave a Comment

The threats organizations are facing continue to evolve, and so are the tools they use to manage an emergency. It’s not enough to just alert people that an emergency is occurring. Organizations need robust solutions that give them the ability to actively manage an event from beginning to end. That’s why many mass notification solutions […]

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The Royal Society Adopts CCC RightsLink for Scientific Communications to Scale Open Access Institutional Agreements

February 2, 2022 TechDecisions Staff Leave a Comment

DANVERS, Mass.–(BUSINESS WIRE)–#OA—CCC, a leader in advancing copyright, accelerating knowledge, and powering innovation, announces The Royal Society, the UK’s National Academy of Science, has adopted RightsLink for Scientific Communications (RLSC) to support its Open Access (OA) institutional agreements. The Royal Society was founded in 1660 and is a fellowship of the world’s most eminent scientists […]

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Springboard and UMass Global Launch a Four-Program Technical Skills Online Learning Partnership

January 31, 2022 TechDecisions Staff Leave a Comment

Springboard’s largest university partnership delivers mentor-led online educational bootcamps to help working adults SAN FRANCISCO–(BUSINESS WIRE)–Springboard, an online learning platform preparing students for in-demand careers through comprehensive, mentor-led programs, and the University of Massachusetts Global (UMass Global) today announced a four-program partnership with tracks in Cybersecurity, Data Analytics, Data Science, and Software Engineering. The partnership […]

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IOWN Global Forum Releases A Six Reference Document “Starter Pack” for Creating an Intelligent, Energy-Efficient All-Photonics Data and Communications Architecture

January 31, 2022 TechDecisions Staff Leave a Comment

Reference Documents Will Be Featured at the IOWN Global Forum Member Meeting Feb. 15-17, 2022 WAKEFIELD, Mass.–(BUSINESS WIRE)–#iown–The Innovative Optical and Wireless Network Global Forum (IOWN Global Forum) has released six technology reference documents, in support of its goal to provide reliable, high-speed, low-latency data and communications paths using an all-optical data transport architecture. The […]

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Harbor Link Breaks Ground in Baltimore on New Telecommunications Infrastructure Project

January 25, 2022 TechDecisions Staff Leave a Comment

Harbor Link is constructing 60-Miles of new conduit to enhance and diversify digital infrastructure between Baltimore and Northern Virginia BALTIMORE–(BUSINESS WIRE)–#FelixDialoiso—Harbor Link Holdings LLC, a Maryland based company and a leader in telecommunications infrastructure, announces today that it has broken ground on the construction of a new 60-mile, diverse conduit route set to enhance connectivity […]

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PowerSchool to Acquire Kinvolved, Expanding K-12 Platform to Provide Critical Messaging and Communication Solution to Improve Engagement and Student Outcomes

January 25, 2022 TechDecisions Staff Leave a Comment

By adding Kinvolved’s industry-leading two-way communication, attendance, and engagement technology to PowerSchool, schools and districts will benefit from stronger collaboration and enable more equitable partnerships between educators, students, and families. FOLSOM, Calif.–(BUSINESS WIRE)–PowerSchool (NYSE: PWSC), the leading provider of cloud-based software for K-12 education, has signed a definitive agreement to acquire Kinvolved, a leading provider […]

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ISG Says Digital Transformation Reaching Critical Mass in U.S. Public Sector

November 23, 2021 TechDecisions Staff Leave a Comment

Three ISG-hosted webinars will preview 2022 ISG Provider Lens™ research studies on procurement, the future of work and the Microsoft ecosystem for public sector entities STAMFORD, Conn.–(BUSINESS WIRE)–$III #HigherEducation–The shift to digital technology in the public sector is reaching critical mass, as state and municipal agencies seek digital solutions and support from technology and service […]

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Smiths Detection wins contract to supply Radiation Portal Monitors across the US to DHS Countering Weapons of Mass Destruction Office

November 9, 2021 TechDecisions Staff Leave a Comment

EDGEWOOD, Md.–(BUSINESS WIRE)–Smiths Detection, a global leader in threat detection and security screening technologies, today announces that it has been awarded a contract by the U.S. Department of Homeland Security (DHS) Countering Weapons of Mass Destruction Office (CWMD) to provide 110 radiation portal monitors (RPM). Partnering with Radiation Solutions, Inc, the RPM’s will be deployed […]

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Showa Denko Materials to Launch the Mass Production of “MCL-E-795G,” an Ultra-Low CTE Core Material for Next-Generation FC-BGA Package Substrate

October 28, 2021 TechDecisions Staff Leave a Comment

TOKYO–(BUSINESS WIRE)–Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama; hereinafter “Showa Denko Materials”) announces the mass production of the “MCL-E-795G” series, an advanced functional laminate material for printed wiring boards, starting in October 2021. MCL-E-795G achieves high packaging reliability such as low warpage and high heat resistance required for semiconductor package substrates used […]

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