Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications
‘H-Cube’ applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit SEOUL, South Korea–(BUSINESS WIRE)–Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data […]