Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack
Highlights: Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA optimization Native 3D partitioning flow automates intelligent creation of memory-on-logic 3D stacking configuration, providing PPA improvements for 3D stack designs Customers can confidently adopt the Cadence Integrity 3D-IC platform and […]

