SFP-DD MSA Group Announces New SFP112 and SFP-DD112 Specifications

New changes ensure long-term use in hardware and market applications

CHICAGO–(BUSINESS WIRE)–The Small Form Factor Pluggable Double Density (SFP-DD) Multi-Source Agreement (MSA) Group is pleased to announce its updated 5.0 hardware specifications and drawings for the SFP-DD, SFP-DD112, and SFP112 pluggable modules. This revision enables SFP112 operating at 112 Gbps and SFP-DD112 operating at an aggregate rate of 224 Gbps; aligning with next generation higher speed networking, storage and access equipment. This new revision also includes an SFP112 module specification to ensure the industry roadmap from SFP28/SFP56 to SFP112 and SFP-DD to SFP-DD112 maintain overall compatibility.

SFP-DD MSA revision 5.0 hardware specification includes significant signal integrity enhancements to address 112 Gbps differential signaling. Three new clauses have been added as follows: Chapter 5 for SFP112 electrical and management interface requirements, Chapter 8 for SFP-DD 112G mechanical and board definition, and Chapter 9 for SFP112 mechanical and board definition. In addition, the new revision includes an ePPS/Clock signal definition for SFP-DD/SFP-DD112. Lastly, TS-1000 Normative Module and Connector performance requirements for SFP112 were added into Appendix A.

Maintaining SFP-DD and SFP for future applications

This critical addition to the MSA specification ensures the industry will be able to continue to leverage the single channel and two channel form factors for current and future generations of equipment and market applications. Updating both SFP+ and SFP-DD form factors enables the SFP-DD host equipment ports to be able to reliably accept SFP112 modules as has been a crucial use case with prior generations. Additionally, this effort can maintain SFP+ and SFP-DD power capability alignment with trends and technologies. The SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers while still enabling the use of legacy SFP modules. This updated specification supersedes previous versions and has updated mechanical connector dimensions.

SFP-DD MSA promoters include Alibaba Group, Broadcom, Cisco, Dell Technologies, Hewlett Packard Enterprises, Huawei, II-VI Incorporated, Intel, Juniper Networks, Lumentum, Molex, Nvidia and TE Connectivity. Contributors include Accelink, Amphenol, AOI, Eoptolink, Foxconn Interconnect Technology, Fourte International, Genesis Connected Solutions, Hisense Broadband, Infinera, InnoLight, Maxim Integrated, Multilane, Nokia, Senko, Source Photonics, US Conec, Yamaichi Electronics, and ZTE.

To download the SFP-DD updated hardware specification and drawings or to explore opportunities for becoming a contributing member, please visit the MSA website www.sfp-dd.com.