Showa Denko Materials to Launch the Mass Production of “MCL-E-795G,” an Ultra-Low CTE Core Material for Next-Generation FC-BGA Package Substrate
TOKYO–(BUSINESS WIRE)–Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama; hereinafter “Showa Denko Materials”) announces the mass production of the “MCL-E-795G” series, an advanced functional laminate material for printed wiring boards, starting in October 2021. MCL-E-795G achieves high packaging reliability such as low warpage and high heat resistance required for semiconductor package substrates used […]